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All Listings > Commercial Equipment > Medical Equipment & Supplies > Cohu Neon P11298 - Inspection Platform for Semiconductors Used in Automotive, Consumer, Industrial and Medical, and Mobility Applications (1 Unit)

Cohu Neon P11298 - Inspection Platform for Semiconductors Used in Automotive, Consumer, Industrial and Medical, and Mobility Applications (1 Unit)

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ID: 183009276
Quantity: 1 Unit
Manufacturer: Cohu,Inc.
View more items from this manufacturer
Model: P11298
Condition:

Damaged, This equipment got rolled over on its side down when moving by forklift.

Being sold "AS IS, WHERE IS". Buyer is responsible for shipping and handling.

# of Bids: 1 PLACE A BID
Original Wholesale Value: $470,000.00
Claim Value: $470,000.00
Product Location: China
End Time: Bid As Soon As Possible
Time Remaining: Bid As Soon As Possible
Trader: Ateeq Asar   +1(832) 564 3640ASK A QUESTION

Seller Description

This Neon P11298 - Market Leading Inspection Yield with Uncompromised Throughput (1 Unit) is no longer needed for company's own operation and is being sold as an asset liquidation for its owner.

Productivity

  • Up to 40,000 UPH with 6S inspection
  • Up to 38,000 UPH with HR / IR sidewall
  • Unique force limitation control for thin and fragile handling at high speed
  • Wafer management and Mapfile processing for enhanced traceability
  • Cassette loading/unloading designed for Industry 4.0

Flexibility

  • Wide Film Frame Carrier applicable device range 0.2 x 0.4 mm to 12 x 12 mm
  • Available in 16 or 32 pickup arms for process optimization
  • Up to 23 available turret positions to accommodate required process
  • Complete integrated solution for back-end finishing process
  • Flip and Non-Flip process capable
  • Detaping to Tape process capable
  • Multi-Taping output capable
  • Full 6S inspection

Specifications
Platform

Wafer Input Media

  • Film frame carrier: 4” to 12”
  • Round and rectangular / plastic and metal frame
  • Wafer cassette: 25 x 8”, 13 x 12”

Device Range

  • WLCSP & QFN: 0.2 x 0.4 mm to 12 x 12 mm / thickness ≥0.070 mm

Index Time

  • Down to 80 ms, depending on device and process

Performance Characteristics

  • WLCSP: up to 38,000 UPH including inspection
  • QFN: up to 40,000 UPH including inspection
  • MTBA: typ. >2 h
  • MTBF: typ. >168 h
  • Conversion time: typ. <45 min

Interface

  • TTL parallel interface for Tester and Laser
  • RS232, GPIB (optional)
  • Network: Ethernet capability
  • Wafer Mapping: SECS GEM
  • (SEMI E4, 5, 30, 37 SEMIG84)

ESD

  • According to ANSI / ESD SP10.1
  • ESD Class o (optional)

Facility Requirements

  • 1 x 230 VAC ± 10%, 0 / 60 Hz
  • Avg. 2.9 kW with vacuum pump and hot air blower
  • Air Pressure range: 5-10 bar ± 0.5 bar
  • Air consumption: 70 I/min maximum
  • Vacuum (input) 500-700 mbars abs
  • Consumption: approx. 400 I/min
  • Clean room level: 10k class

Dimensions

  • Overall dimension for Std Die Sort: 2.1 x 1.6 x 2.0 m
  • Overall dimension with Reel input & ARC: 2.7 x 1.7 x 2.0 m
  • Floor space requirement: 3.0 x 2.0 x 2.0 m
  • Weight: net typ. 1400 kg / gross typ. 1600 kg

Standards

  • CE
  • S2/S8 assessment
  • 2006/42/EC Machinery
  • 2004/108/EC Electromagnetic compatibility (EMC)

Process Capabilities
Input

  • Wafer Frame, Reel input

Output

  • Tape & Reel

Processes

  •  Device Flip
  • X-Y-T touchless precisor
  • 6 Sides Vision inspection
  • Infrared inspection
  • Dual Tape & Reel with flip-flop
  • Automatic rejection & replacement in-tape
  • Input & Output Wafer map with full device traceability

Options

  • Non-Flip
  • Reel input
  • Auto Reel Changer
  •  O/S Test
  • Laser Marking

NV-Core Inspection System

  • Full wafer map traceability & skeleton check with ViewMap®
  • 2D/3D ball/bump height & co-planarity with 3D Flex®
  • Full 6 Sides inspection with 10 µm defect detectability
  • WLCSP Sidewall inspection
  • 5 µm crack detectability with advanced inspection algorithm and optics
  • Down to 1 µm crack detectability with Infrared inspection
  • Top, Bottom, Side & In-Tape Infrared inspection capable
  • Dimensional, Mark, Surface, 5S, Color Vision
  • 1D/2DMC code reader
  • Pre-Tape, In-Tape, Post Sealing inspection

Seller Terms

  • Salvex and the seller have the right to reject any and all offers.
  • This product is sold AS IS, WHERE IS.
  • Buyer is responsible for all taxes, duties, loading and freight charges.
  • Seller does not offer any warranties or manufacturer warranties.
  • Upon receipt of cleared funds, Seller will provide the Buyer a Release Order for item pick up. Title transfers from Seller to Buyer upon issuance of the Release Order.
  • It is Buyer's responsibility to verify quantities and condition at the time of pick up. Once the product has been removed from Seller's location, there will be no adjustments based on quantity or condition.
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